Study Destination: Australia
University: Bond University
Opportunity Type: Undergraduate Scholarship
Scholarship Value: 25% tuition remission
Applications Open: 1 May 2026 at 10am AEST
Closing Date: 31 August 2026 at 11:59pm AEST
The Bond University Leadership Scholarship supports current Year 12 students who have strong academic results, leadership experience, and community involvement. Through this scholarship, selected students receive 25% tuition remission for an eligible undergraduate degree at Bond University.
About the Bond University Leadership Scholarship
Bond University created this scholarship to recognise students with leadership and community achievements. The scholarship also considers academic achievement.
The award provides partial tuition support. It applies to any single or approved combined undergraduate degree. However, Bond excludes the Medical Program and Diploma entry students from this scholarship.
Selected students may begin at Bond in January, May, or September. As a result, applicants can match the scholarship with an eligible intake.
What the Scholarship Provides
The scholarship gives a tuition fee reduction for eligible undergraduate study.
✓ 25% tuition remission
✓ Support for single undergraduate degrees
✓ Support for approved combined undergraduate degrees
✓ Entry available in January, May, or September
The scholarship does not cover the Bond Medical Program. It also does not apply to Diploma entry students.
Who Can Apply
Applicants must meet the scholarship rules.
• Applicants must currently complete Year 12 or equivalent
• Applicants must apply for undergraduate study
• Applicants must not have started study at Bond or another tertiary institution
• Applicants must achieve at least ATAR 84.00 or IB Diploma 30
• Applicants must show leadership, community, and extra-curricular achievements
• Applicants must meet the entry requirements for their chosen program
Eligible applicants include Australian or New Zealand citizens and Australian permanent residents completing Year 12 or equivalent inside or outside Australia. Australian or Australian permanent resident students completing high school outside Australia may also apply. International students completing Year 12 or equivalent in Australia can apply as well.
Documents and Evidence
Applicants need to submit specific materials with the scholarship application.
• Evidence of leadership, initiative, and service
• Summary of Achievements template
• Leadership Scholarship Supporting Document
• Supporting evidence for leadership achievements
• Two academic responses
• Career advisor details for a school reference
Bond University requires applicants to use the Summary of Achievements template. If applicants submit this evidence in another format, such as a CV or resume, Bond states that the application cannot be considered.
Written Response Requirements
The application includes two academic response questions.
The first response asks applicants to describe a time when feedback affected their motivation. Applicants must analyse the effect of that feedback. They must also explain their response or what they should have done.
The second response asks applicants to discuss a group project where members had different priorities. Applicants must explain what caused the project to succeed or fail.
Each response must be 250 words. In addition, applicants must use first-person language and avoid research, quotes, referencing, and generative AI.
How to Apply
Applicants must follow the online application process.
• Complete the Bond University Study Application Form
• Lodge an application for the chosen program
• Complete the Bond University Scholarship Application Form
• Use the same login details used for the study application
• Enter “scholarship” in the keyword field on the “Start an Application” tab
• Submit before the scholarship deadline
Bond University states that late scholarship applications will not be considered. Therefore, applicants should complete both required steps on time.
Selection Process
Bond University reviews applications after the scholarship closing date. Then, applicants receive an email with the next steps for the relevant scholarship.
The selection process may differ by scholarship. Still, Bond University confirms that all applicants will receive the outcome by email.
Deadline
• Application opening date: 1 May 2026 at 10am AEST
• Application closing date: 31 August 2026 at 11:59pm AEST
• Entry year: 2027
• Multiple scholarship applicants must submit by the earliest relevant deadline
Applicants may apply for more than one scholarship through one scholarship application form. However, Bond will only consider applicants for the scholarships they select before submitting the form.
